Design Innovation : Development of A Device for Measuring The Transverse Motion of A Saw-Wire  

Oleh:

Mizuno, Masahiro ; Iyama, Toshirou ; Kikuchi, Shinya ; Zhang, B.

Jenis: Article from Journal - ilmiah internasional
Dalam koleksi: Journal of Manufacturing Science and Engineering vol. 128 no. 3 (Agu. 2006), page 826-834.
Topik: MEASURING; motion; device for measuring; transverse motion; saw-wire

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ93.8 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

The transverse motion of a saw - wire affects the cutting surface geometry in wire - saw slicing. To evaluate the magnitude of the wire transverse motion under no - slurry and no - workpiece conditions, which should be minimized before starting the slicing process, a high accuracy, noncontact device has been developed. The measuring head of the device is composed of a laser diode module and a dual - element photodiode between which a saw - wire is placed for measurement. This paper elucidates the appropriate positional configurations of the photosensitive surface of the dual - element photodiode and the laser beam focal point with respect to the 160 µm diameter wire in the laser beam direction. Furthermore, a measurement experiment is carried out on a wire - saw machine under no - slurry and no - workpiece conditions. The paper reports and discusses the critical issues, such as measurement sensitivity, linearity, and accuracy.

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