Microscale Laser Shock Peening of Thin Films, Part 2 : High Spatial Resolution Material Characterization  

Oleh:

Wenwu, Zhang ; Yao, Y. Lawrence ; Noyan, I. C.

Jenis: Article from Journal - ilmiah internasional
Dalam koleksi: Journal of Manufacturing Science and Engineering vol. 126 no. 1 (Feb. 2004), page 18-24.
Topik: microscale; microscale; laser shock; high spatial resolution; material characterization

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ93.4 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

Microscale Laser Shock Peening (LSP) is a technique that can be potentially applied to manipulate the residual stress distributions in metal film structures and thus improve the reliability of micro - devices. This paper reports high - spatial - resolution characterization of shock treated copper thin films on single -crystal silicon substrates, where scanning x - ray microtopography is used to map the relative variation of the stress / strain field with micron spatial resolution, and instrumented nanoindentation is applied to measure the distribution of hardness and deduce the sign of the stress / strain field. The measurement results are also compared with 3 - D simulation results. The general trends in simulations agree with those from experimental measurements. Simulations and experiments show that there is a near linear correlation between strain energy density at the film - substrate interface and the X - ray diffraction intensity contrast.

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