Optimal Tool Re-Allocation Method in the Semiconductor FAB  

Oleh:

Kim, Junghoon ; Jang, Young Jae

Jenis: Article from Proceeding
Dalam koleksi: The 14th Asia Pacific Industrial Engineering and Management Systems Conference (APIEMS), 3-6 December 2013 Cebu, Philippines, page 1-7.
Topik: semiconductor FAB; layout; re-allocation; dynamic environments
Fulltext: 1247.pdf (585.82KB)

Isi artikel

This paper presents the method for optimal re-allocating the semiconductor equipment (tools) in the semiconductor fabrication plant (FAB) to minimize the layout change cost. In recent dynamic manufacturing environments, demand patterns are varying dramatically due to high product variety and short product life cycles. These varying demand patterns lead to changes in production plans, and ultimately the number of tools for production. Therefore, there exist different optimal layouts since the tool planning is changed according to varying demands. We have been observed that the tools are rearranged manually without any specific optimized standard. There is a need for the development of an optimized approach for the systematic layout planning. Currently, there are many researches available for the arrangement of tools in the bay or assignment of tools to the bay, but no work has been done to present a plan for the rearrangement of tools. Our Research presents the mathematical model of the rearrangement of tools in a semiconductor fab layout to minimize cost. A comparison has been made with the existing optimal layout for a weekly varying production plan.

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