Six Sigma Case Study:Bond Finger Nodule LRR Improvement  

Oleh:

Chung, Allen ; Ho, Jimmy ; Lien, Wallace

Jenis: Article from Proceeding
Dalam koleksi: 12th ANQ Congress in Singapore, 5-8 Agustus 2014, page 1-8.
Topik: BGA (Ball Grid Array); Wire-bonding substrate; LRR (Lot Reject Rate); Six Sigma Methodology; Design of Experiment
Fulltext: SS1-1.4-P0425.pdf (544.84KB)

Isi artikel

Since 1990’s, BGA (Ball Grid Array) assembly technology was developed by Motorola (American company) and Citezen (Japanese company) to support high I/O count design requirement. IC substrate is a primary carrier and widely used by the BGA assembly technology. Wire bonding substrates extensively apply to 3C products, Memory, storage devices and etc. Failure for the wire bonding substrates shows that Bond Finger (BF) nodule defect contributes as top 1 defect mode at bond finger area which occupied 61.5% defect rate of overall defects and caused customer LRR (Lot Reject Rate) is 0.27% which induced additional quality cost. Hence, it is important to set up a quality improvement team to identify the root causes of the BF nodule failure to reduce the defective product being produced. To improve this problem, the Six Sigma Methodology of DMAIC (Define, Measure, Analyze, Improve, Control) is deployed on this project. There are several tools applied for the problem investigation, such as SIPOC, Cause & Effect Matrix analysis, Pareto, ANOVA, Normality analysis and DOE (Design of Experiment). Initial investigation indicates several factors in Ni plating tank contribute this defect phenomenon. By Cause & Effect Matrix and Pareto analysis, four factors are clarified as most possible root causes. To tackle this problem, DOE conducted to figure out the optimized process control conditions and the results showed significant difference from original condition. With this positive test results, the customer LRR enables to reduce from 0.27% to 0.04%, which is 85% improvement leading to 70.8% cost saving! It is encouraging for the team to continue to proceed the quality improvement with Six Sigma Methodology for other defect improvement in the future

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