Defection and Maximum Load of Microfiltration Membrane Sieves Made With Silicon Micromachining  

Oleh:

Elwenspoek, M. ; Wekken, M. van der ; Nijdam, W. ; Rijn, C. van

Jenis: Article from Bulletin/Magazine
Dalam koleksi: Journal of Microelectro Mechanical System vol. 6 no. 1 (1997), page 48-54.
Topik: MEMBRANES; defection; maximum load; microfiltration; membrane; sieves made; silicon; micromachining

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ30.2 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

With the use of silicon micromachining, an inorganic membrane sieve for microfiltration has been constructed having a silicon nitride membrane layer with thickness typically 1 µm and perforations typically between 0.5 µm and 10 µm in diameter. As a support a <100> - silicon wafer with openings of 1000 µm in diameter has been used. The thin silicon nitride layer is deposited on an initially dense support by means of a suitable chemical vapor deposition method (LPCVD). Perforations in the membrane layer are obtained with use of standard photo lithography and reactive ion etching (RIE). The deflection and maximum load of the membrane sieves are calculated in a first approximation. Experiments to measure the maximum load of silicon - rich silicon nitride membranes have confirmed this approximation.

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