Thermal Resistance of Particle Laden Polymeric Themal Interface Materials  

Oleh:

Koning, Paul ; Shipley, Jim ; Prasher, Ravi S. ; Prstic, Suzana

Jenis: Article from Bulletin/Magazine
Dalam koleksi: Journal of Heat Transfer vol. 125 no. 6 (Dec. 2003), page 1170-1177.
Topik: POLYMERIC COMPOSITES; thermal resistance; particle laden polymeric; thermal interface; material

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ90.7 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIM s affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semiempirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIM s.

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