Computer Simulation Of The Effect Of Thermal Contact Resistance On Cooling Time In Injection Molding  

Oleh:

Sridhar, L. ; Narh, K. A.

Jenis: Article from Journal - ilmiah internasional
Dalam koleksi: Simulation vol. 73 no. 3 (Mar. 1997), page 144-148.
Topik: Injection molding; thermal contact resistance; TCR; heat transfer
Fulltext: 144.pdf (454.81KB)

Isi artikel

Thermal contact resistances (TCR) play an important role in heat transfer. TCR is therefore of significance in the simulation of injection molding processes where one of the factors determining productivity is the cooling time. Simulation software packages either consider TCR as negligible or use a constant value based on steadystate conduction, whereas in injection molding, TCR is time-dependent. We use simulation of the injection molding process to show that using TCR values within the range obtained from steady state experiments may lead to underpredicting cooling times by up to 15% and, hence, there is a need to use time-dependent TCR in the heat transfer simulations. Our simulation result indicates that the value of TCR also affects the frozen layer fraction in the early postfilling period.

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