Modeling of Material Removal Rate in Micro-ECG Process  

Oleh:

Gaikwad, Kishore S. ; Joshi, Suhas S.

Jenis: Article from Journal - ilmiah internasional
Dalam koleksi: Journal of Manufacturing Science and Engineering vol. 130 no. 3 (Jun. 2008), page 034502.
Topik: Micromachining; Micro-ECG; Electrochemical Grinding; Material Removal Rate; CFD Simulation; Abrasion

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ93.11 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

Microelectrochemical grinding (micro-ECG) is a variant of electrochemical grinding (ECG) process, in which material is removed by a combination of electrolytic dissolution and abrasive action that take place in a small interelectrode gap. This paper discusses analytical modeling of the material removal phenomenon in micro-ECG process to predict material removal rate. In the model, the phenomena, which controbute to the material removal in the process by electrolytic and abrasive actions, have been considered; these include streaming potential in the electrochemical action and hearing forces due to the flow of electrolyte through interelectrode gap and the abrasve action of grinding whee. Two configurations of the process, viz., surface and cylindrical micro-ECG, have been modeled. The results have been validated by CFD simulation in the case of surface micro-ECG process, and specific experimentation in the case of cylindrical micro-ECG process.

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