Detail Packaging of Microsystems for Harsh Environments   Oleh:  Sparjs, D. R. Jenis: Article from Bulletin/Magazine Dalam koleksi: IEEE Instrumentation & Measurement Magazine vol. 4 no. 3 (2001), page 30-33. Topik: natural environments; packing; microsystems; harsh environments Ketersediaan Perpustakaan Pusat (Semanggi) Nomor Panggil: II47.2 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada     Lihat Detail Induk Isi artikel Micromachined devices have great potential but using these fragile structures in aggressive environments can pose a challenge. Mechanical shock, chemical exposure, and temperature extremes can damage delicate microsystems. Also, substantial effort is often put forth to develop a device concept only to find later that the device is difficult or expensive to package suitably in a consumer or automotive environment. The cost of materials, processing, and manufacturing make the sensor or actuator device impractical for some applications. A successful MEMS device manages the proper balance for its application between the high device performance and low unit cost. The packaging of MEMS begins with a consideration of the microsystem's environment. An aerospace, automotive, or industrial component could be subjected to temperatures ranging from -40° C to over 150° C. Mechanical shocks in the 10 g to + 500 g range can be experienced which can fracture poorly designed silicon beams. Chemical exposure, which can corrode silicon, or the metal interconnection lines on silicon, and shift electrical parameters, are challenges that must be overcome in these applications. Opini Anda Klik untuk menuliskan opini Anda tentang koleksi ini! Kembali

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