Detail Plastic-Encapsulated Components for Cars   Oleh:  Hanreich, G. ; Nicolics, J. ; Musiejovsky, L. Jenis: Article from Bulletin/Magazine Dalam koleksi: IEEE Instrumentation & Measurement Magazine vol. 4 no. 2 (2001), page 16-21. Topik: task components; plastic - encapsulated; components; cars Ketersediaan Perpustakaan Pusat (Semanggi) Nomor Panggil: II47.2 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada     Lihat Detail Induk Isi artikel Thermal management in electronics packaging is important. Thermal stress greatly affects reliability and aging of electronic circuits. Our group developed a thermal simulation tool named TRESCOM for investigating thermal problems in electronic packaging. We used this tool for steady - state and dynamic analyses of the thermal qualities of PLCC and CLCC components. Our investigation demonstrated the surprising result that the thermal performance of the plastic encapsulated components is superior to hermetically sealed ceramic components. We conclude that plastic packages are reliable and can compete with ceramic packages at the elevated temperatures that are found in automotive applications. Opini Anda Klik untuk menuliskan opini Anda tentang koleksi ini! Kembali

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