Enhanced Boiling of FC-72 on Silicon Chips With Micro-Pin-Fins and Submicron-Scale Roughness  

Oleh:

Honda, H. ; Takamatsu, H. ; Wei, J. J.

Jenis: Article from Bulletin/Magazine
Dalam koleksi: Journal of Heat Transfer vol. 124 no. 2 (Apr. 2002), page 383-390.
Topik: SILICON OXIDATION; enhanced boiling; FC - 72; silicon chips; micro - pin - fins; submicron - scale roughness

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ90.3 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

Experiments were conducted to study the effects of micro - pin - fins and submicron - scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas -dissolved FC - 72. Square pin - fins with fin dimensions of 50 × 50 × 60 µm(3) (width × thickness × height) and submicron - scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip (10 × 10 × 0.5 mm(3)) by use of microelectronic fabrication techniques. Experiments were conducted at the liquid subcoolings of 0, 3, 25, and 45 K. Both the micro - pin - finned chip and the chip with submicron - scale roughness showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The chip with submicron - scale roughness showed a higher heat transfer performance than the micro - pin - finned chip in the low - heat - flux region. The micro - pin - finned chip showed a steep increase in the heat flux with increasing wall superheat. This chip showed a higher heat transfer performance than the chip with submicron - scale roughness in the high - heat - flux region. The micro - pin - finned chip with submicron - scale roughness on it showed the highest heat transfer performance in the high - heat - flux region. While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid subcooling.

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