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Thermal Transport Mechanisms at Nanoscale Point Contacts
Oleh:
Li, Shi
;
Majumdar, Arunava
Jenis:
Article from Bulletin/Magazine
Dalam koleksi:
Journal of Heat Transfer vol. 124 no. 2 (Apr. 2002)
,
page 329-337.
Topik:
thermal conductivity
;
thermal transport mechanisms
;
point contacts
Ketersediaan
Perpustakaan Pusat (Semanggi)
Nomor Panggil:
JJ90.3
Non-tandon:
1 (dapat dipinjam: 0)
Tandon:
tidak ada
Lihat Detail Induk
Isi artikel
We have experimentally investigated the heat transfer mechanisms at a 90 ± 10 nm diameter point contact between a sample and a probe tip of a scanning thermal microscope (SThM). For large heated regions on the sample, air conduction is the dominant tip - sample heat transfer mechanism. For micro / nano devices with a submicron localized heated region, the air conduction contribution decreases, whereas conduction through the solid - solid contact and a liquid meniscus bridging the tip - sample junction become important, resulting in the sub - 100 nm spatial resolution found in the SThM images. Using a one dimensional heat transfer model, we extracted from experimental data a liquid film thermal conductance of 6.7 ± 1.5 nW/K. Solid - solid conduction increased linearly as contact force increased, with a contact conductance of 0.76 ± 0.38 W/m2 - K - Pa, and saturated for contact forces larger than 38 ± 11 nN. This is most likely due to the elastic - plastic contact between the sample and an asperity at the tip end.
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