Deposition of Diamond in Copper by Triboadhesion  

Oleh:

Lelis, J. M. Rodriguez ; Calderon, J. Porcayo ; Robles, J.M. ; Ocempo, J. Colin

Jenis: Article from Journal - ilmiah internasional
Dalam koleksi: Journal of Manufacturing Science and Engineering vol. 125 no. 3 (Aug. 2003), page 628-630.
Topik: fused deposition; deposition; diamond; copper; triboadhesion

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ93.4 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns depth can be formed. This film has particles from 10 to 1 microns and the concentration of diamond decreases with depth. A change on the crystalline structure caused by temperatures closer to the melting point achieved by the process was also found.

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