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Shear Strength and Fracture Surface Studies of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging Under Isothermal Ageing
Oleh:
Mallik, Sabuj
;
Mehdawi, Ahmed Z. El
Jenis:
Article from Books - E-Book
Dalam koleksi:
Transactions on Engineering Technologies: Special Volume of the World Congress on Engineering 2013
,
page 31-41.
Topik:
Ball grid array
;
Ductile and brittle fractures
;
Isothermal ageing
;
Lead free solder alloy
;
Shear strength
;
Solder joint
Fulltext:
03_978-94-017-8831-1_Mallik_El Mehdawi.pdf
(1.01MB)
Isi artikel
Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures. The aim of this study is to investigate the mechanical integrity of leadfree ball grid array (BGA) solder joints subjected to isothermal ageing at 150 and 175 _C, for up to 1,000 h. Upon ageing at 150 _C the Sn-3.5Ag solder alloy initially age-softened for up to 200 h. This behaviour was linked to the coarsening of grains. When aged beyond 200 h the shear strength was found to increase up to 400 h. This age-hardening was correlated with precipitation of hard Ag Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. Samples aged at 175 _C showed a similar behaviour with a reduced initial age-softening period and higher shear force values. Investigation of the fracture surfaces under a Scanning Electron Microscope (SEM) revealed that higher ageing temperature would expose the solder joints to brittle failures.
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