Packaging and Integration of High-Speed Optical Components  

Oleh:

Ray, C.

Jenis: Article from Bulletin/Magazine
Dalam koleksi: IEEE Instrumentation & Measurement Magazine vol. 7 no. 2 (May 2004), page 60-62.
Topik: optical sensor; packaging; integration; high - speed; optical components

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: II47.5 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

Lihat Detail Induk

Isi artikel

Packaging of high - speed optical components is a complex process involving many interdisciplinary engineering efforts. The design of a packaged component is an interesting combination of optical, mechanical, electrical, and process engineering. This article shows how solving assembly and packaging problems can accelerate the progress in microsystem applications. In this article, automated assembly integrates over 50 specific functions into an array for a low - cost component. The techniques are applicable for other measurement microsystems in different fields of applications for measurement, control, and communications.

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