Detail Pumping Ions   Oleh:  [s.n] Jenis: Article from Bulletin/Magazine Dalam koleksi: The Economist (http://search.proquest.com/) vol. 402 no. 8774 (Mar. 2012), page s6. Topik: Computer Chip; Cooling 3D Chips; Ions Ketersediaan Perpustakaan Pusat (Semanggi) Nomor Panggil: EE29.70 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada     Lihat Detail Induk Isi artikel As more and more components are packed onto computer chips, the problems of getting electrical energy to where it is needed in a microprocessor, and of dispersing the heat which that energy is turned into by the chip's operation, both become harder. The latest aspiration of chip designers--to stack the things on top of one another so that their components can communicate in three dimensions--complicates matters still further. But a group of engineers at IBM think they have a single answer to both problems. Opini Anda Klik untuk menuliskan opini Anda tentang koleksi ini! Kembali

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