A Wafer-Bonded Floating-Element Shear Stress Microsensor With Optical Position Sensing by Photodiodes  

Oleh:

Padmanabhan, A. ; Goldberg, H. ; Breuer, K. D. ; Schmidt, M. A.

Jenis: Article from Bulletin/Magazine
Dalam koleksi: Journal of Microelectro Mechanical System vol. 5 no. 4 (1996), page 307-315.
Topik: optical sensor; wafer - bonded; floating - element; shear; stress; microsesor; optical; position; sensing; photodiodes

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ30.1 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

This paper discusses a non invasive sensing technique for the direct measurement of low - magnitude shear stresses in laminar and turbulent air flows. The sensing scheme detects the flow - induced in - plane displacement of a microfabricated floating - element structure (500 µm × 500 µm × 7 µm), using integrated photodiodes. The wall - mounted floating - element sensors were fabricated using a wafer - bonding technology. The sensors were calibrated in a custom - designed laminar flow cell and subsequently shown to be able to transduce shear stresses of 0.01 Pa during tests in a low - speed wind tunnel.

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