A Hermetic Glass-Silicon Micropackage With High-Density On-Chip Feed Throughs for Sensors and Actuators  

Oleh:

Najafi, K. ; Arx, J. A. Von ; Ziaie, B. ; Dokmeci, M. R.

Jenis: Article from Bulletin/Magazine
Dalam koleksi: Journal of Microelectro Mechanical System vol. 5 no. 3 (1996), page 166-179.
Topik: SILICON OXIDATION; hermetic; glass - silicon; micropackage; high density; sensors; actuators

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ30.1 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

This paper describes the development of a hermetic micropackage with high - density on - chip feedthroughs for sensor and actuator applications. The packaging technique uses low - temperature (320 °C) electrostatic bonding of a custom - made glass capsule (Corning 7740, 2 × 2 × 8 mm(3)) to fine grain polysilicon in order to form a hermetically sealed cavity. High - density on - chip multiple polysilicon feedthroughs (200 per millimeter) are used for connecting external sensors and actuators to the electronic circuitry inside the package. A high degree of planarity over feedthrough areas is obtained by using grid - shaped polysilicon feedthrough lines that are covered with phosphosilicate glass (PSG), which is subsequently reflown at 1100 °C in steam for 2 h. Saline and DI water soak tests at elevated temperatures (85 and 95 °C) were performed to determine the reliability of the package. Preliminary results have shown a mean time to failure (MTTF) of 284 days and 118 days at 85 and 95 °C, respectively, in DI water. An Arrhenius diffusion model for moisture penetration yields an expected lifetime of 116 years at body temperature (37 °C) for these packages. In vivo tests in guinea pigs and rats for periods ranging from one to two months have shown no sign of infection, inflammation, or tissue abnormality around the implanted package.

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