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Oleh:

Gernert, Nelson J.

Jenis: Article from Bulletin/Magazine - ilmiah internasional
Dalam koleksi: Machine Design (Soft Copy ada dalam http://search.proquest.com/) vol. 82 no. 18 (Oct. 2010), page 58.
Topik: Heat-pipe Technology; Heat Sinks; Microprocessors

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: MM44.62 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Power semiconductors are encountering the same thermal control situations experienced by the microprocessor industry in the early 1990s. As microprocessor speed increased, so did the amount of heat generated by the microprocessor chip. Depending on the particular application, the heat released ranged from 10 to 150 W. For cost savings, this heat is typically rejected to ambient air. Conventional cooling approaches, such as extruded heat sinks, placed under constrained conditions were insufficient to meet the ever-growing cooling needs of the micro-processor. The computer industry found a solution using heat pipes. Today, heat pipes are used extensively for cooling microprocessors in laptops, desktop computers, high-performance servers, and workstations.

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