Forced Convection Heat Transfer From A Low-Profile Block Simulating A Package of Electronic Equipment  

Oleh:

Nakamura, Hajime ; Igarashi, Tamotsu

Jenis: Article from Bulletin/Magazine
Dalam koleksi: Journal of Heat Transfer vol. 126 no. 3 (Jun. 2004), page 463-470.
Topik: ELECTRONIC; forced convection; heat transfer; low - profile block; electronic equipment

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ90.8 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

Forced convection heat transfer from a low-profile block placed in a rectangular duct, simulating heat transfer in a compact packaged electronic device, is investigated experimentally. Local heat transfer from the block is measured by an infrared camera. A general correlation of the Nusselt number for the block is derived using a modified Reynolds number, Re(L)= (Um / b(2)) L / v, where Um is mean duct velocity, b is the opening ratio of the duct, and L is the block length. The correlation is shown to be applicable regardless of the configuration of the block and duct, under the conditions of laminar flow, a low - profile block (height / length < 0.5), and a low blockage effect (b >= 0.5).

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