Lasers link plastic parts  

Oleh:

Brunnecker, Frank

Jenis: Article from Bulletin/Magazine - ilmiah internasional
Dalam koleksi: Machine Design (Soft Copy ada dalam http://search.proquest.com/) vol. 81 no. 12 (Jun. 2009), page 46.
Topik: Printed-Circuit Boards (PCBs); Laser Through-Transmission Welding (LTTW); Laser Staking

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: MM44.59 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

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Isi artikel

Manufacturers of electronic components with printed-circuit boards (PCBs) have a new method for mounting PCBs to their respective thermoplastic housings or substrates: laser staking. The technology uses the same principles as laser plastic welding. A material transparent to the laser beam is joined to a material which absorbs the laser energy. The absorbed energy is transmitted as heat through the absorbing material and melts both the absorber and the transparent layer through conduction. The technique is sometimes referred to as laser through-transmission welding (LTTW).

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