Detail Control Challenge in Semiconductor Packaging   Oleh:  Li, Han-Xiong Jenis: Article from Article Dalam koleksi: Final Program and Book of Abstracts: The 4th Asian Control Conference, September 25-27, 2002 (Sep. 2002), page 1828-1833. Topik: Control Challenge; Semiconductor Fulltext: AC021348.PDF (151.16KB) Isi artikel Back-end semiconductor packaging is an important process to IC industry. Control in packaging meets challenge because it is a multi-discipline approach. In general, control in packaging can be classified into categories, such as, motion, fluid and thermal control. In this paper, some critical processes in packaging are briefly introduced and their difficulty for control as well. Focus will be given to vibration control, fluid dispensing control and thermal management. Opini Anda Klik untuk menuliskan opini Anda tentang koleksi ini! Kembali

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