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ArtikelPlastic Deformation in Silicon Crystal Induced by Heat-Assisted Laser Shock Peening  
Oleh: Cheng, Gary J. ; Cai, M. ; Pirzada, Daniel ; Guinel, Maxime J. F. ; Norton, M. Grant
Jenis: Article from Journal - ilmiah internasional
Dalam koleksi: Journal of Manufacturing Science and Engineering vol. 130 no. 1 (Feb. 2008), page 1-5.
Topik: Plastic Deformation; Heat-Assisted Laser Shock Peening
Ketersediaan
  • Perpustakaan Pusat (Semanggi)
    • Nomor Panggil: JJ93.11
    • Non-tandon: 1 (dapat dipinjam: 0)
    • Tandon: tidak ada
    Lihat Detail Induk
Isi artikelTHe response of solid to shock compression has been an interesting topic for more than a century. The present work is the first attempt to experimentally show that plastic deformation can be generated in brittle materials by a heat-assisted laser shock peeningprocess using silicon crystal as a sample material. Strong dislocation activity and large compressive residual stress are induced by this process. The dislocation structure is characterized with transmission electron microscopy and electron backscattered diffraction. The residual stress is measured using Raman scattering. This work presents a fundamental base for the application of laser shock peening in brittle materials to generate lafge compressive residural stress and plastic deformation for better mechanical properties, such as fatigue life and fracture toughness.
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