Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening  

Oleh:

Wang, Youneng ; Chen, Hongqiang ; Yao, Y. Lawrence ; Kysar, Jeffrey W.

Jenis: Article from Journal - ilmiah internasional
Dalam koleksi: Journal of Manufacturing Science and Engineering vol. 129 no. 3 (Jun. 2007), page 485-496.
Topik: laser; thin films; substrate; micro - scale; laser shock peening

Ketersediaan

Perpustakaan Pusat (Semanggi) Nomor Panggil: JJ93.10 Non-tandon: 1 (dapat dipinjam: 0) Tandon: tidak ada

Lihat Detail Induk

Isi artikel

Micro - scale laser shock peening (µLSP) can potentially be applied to metallic structures in microdevices to improve fatigue and reliability performance. Copper thin films on a single - crystal silicon substrate are treated by using µLSP and characterized using techniques of X - ray microdiffraction and electron backscatter diffraction (EBSD). Strain field, dislocation density, and microstructure changes including crystallographic texture, grain size and subgrain structure are determined and analyzed. Further, shock peened single crystal silicon was experimentally characterized to better understand its effects on thin films response to µLSP. The experimental result is favorably compared with finite element method simulation based on single - crystal plasticity.

Opini Anda

Klik untuk menuliskan opini Anda tentang koleksi ini!

Kembali